Project Ara, for those of you who aren’t familiar, is the modular smartphone that Google is working on that will allow users to swap out their phone’s components whenever they want rather than having to get a new phone. Apparently Google will be bringing Project Ara to MWC 2015 in Barcelona next month where it’s expected to display a few dozen modular components and at least one working version of the modular smartphone.
The latest speculation about Project Ara has the modular phone and some of its parts coming to Barcelona next month for MWC. Fifty modular components are expected to be displayed. While not all of them will be in working condition, we do expect to see a complete working version of the modular handset at the show. Eventually, a Project Ara phone will allow users to upgrade the camera, RAM, GPU, the display and other components by simply snapping out the old part and snapping in the new one. On Wednesday, Toshiba announced that it had partnered up with Gujarat chipmaker Einfochips to produce the chips for the Project Ara handsets. Toshiba’s Senior Vice President and Chief Technology Officer Shardul Kazi says the company has designed two different versions of the phone, the Spiral One and the Spiral Two. Spiral Three will soon be launched and both it and Spiral Two will be offered to consumers.